Oxford Instruments Plasma Technology, the market leader in 300mm dry etch for Failure Analysis offers a unique range of de-processing solutions.
This family of tools offers:
- A range of processes from passivation removal to anisotropic oxide removal including TEOS for gap fill,
processing across a range of customer product sizes from small die or packaged device through to full 300 mm wafer
- A choice of tool from entry level manual load, to load locked 300mm production FA
- A choice of technologies from RIE/PE to ICP etch
- Advanced die process
- Etch rate 20 times faster than standard RIE processes using the Plasma Accelerator
- Flexible tools offering a whole range of processes
- µetch300 for 300mm wafer
- µetchICP is a fast and low damage tool for small die and packaged device
- µetch200 for 200mm wader
- TEOS process for gap fill
Oxford Instruments Plasma Technology also offers process support both in house and in field, and actively supports customer process development.