CMI165
The CMI165 provides unique temperature compensated Copper thickness measurements in an ergonomic hand-held device.
Measurements on Copper are affected by the temperature of the sample. The CMI 165 accounts for temperature in the measurement of thickness ensuring accurate in-process inspection results regardless of Copper temperature. This versatile, portable gauge equipped with protective case, has a rugged and durable design that allows it to be taken into the harshest environments.
- Measure hot or cold Cu on PCBs
- Reduce waste by eliminating the need for coupons
- Measure foil or laminated Cu thickness in μm,mils or oz
- Sort Cu by weight at incoming drilling, shearing or plating
- Quantify Cu thickness after etching or planarizing
- Verify Cu plating thickness on PCB surfaces
- SRP-T1 Replaceable Probe Tip - no recalibration necessary
- Spare SRP-T1 ensures no factory downtime
- Illuminated probe tip for easy positioning on copper traces
- User Interface available in both English and Simplified Chinese