Oxford Instruments CMI563 measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.
The package consists of a versatile hand-held unit equipped with a carry case for protection and portability, a measurement probe, and NIST traceable calibration standards. The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring economical, user-replaceable measurement tips.
- Measure the thickness of copper foil on rigid, flexible, single- and double-sided, or multi-layer PCBs
- Measure foil or laminated copper thickness in mils or µm
- Sort copper by weight at incoming inspection, before drilling, shearing or plating
- Determine electroless or electroplated Cu thickness on PCBs
- Accurately quantify copper thickness after etching or planarizing
- Verify copper plating thickness on PCB surface
- Rugged hand-held 16-button unit featuring a large 4-digit LCD display
- Features Oxford Instruments proprietary, economical, user-replaceable SRP-4 probe tips that can be easily replaced on site minimizing downtime
- Contains fine-line measurement algorithm for measuring on Cu traces
- RS-232 serial port output for a printer or PC download
- Statistical data analysis and reporting with memory location, number of readings, Cu type, date-time stamping, mean, standard deviation, accuracy, high, low, range, cpk, and histogram