Compact open-load system for Atomic Layer Deposition (ALD)

The OpAL® system introduces a unique thermal ALD tool with a clear and easy upgrade route to plasma, providing both plasma and thermal ALD in a single compact tool.
 

  • Open loaded thermal ALD tool with plasma option
  • Field upgrade available for plasma option
  • Small wafer pieces up to full 200mm wafers – equally suitable for academic and industry R&D

System Features and Benefits

OpAL System Benefits:

  • Vapour draw or bubbling of up to four liquid or solid precursors
  • Can be fitted with a nitrogen purged glove box with sample entry load lock for dry environment
  • Easily removable inner chamber reduces chamber cleaning times
  • In-situ analytical options including spectroscopic ellipsometry linked into ALD control software

Safety Features:

  • Cabinet can be fitted to extraction lines and has nitrogen purge for assured health and safety compliance
  • Pneumatic hoist for safe opening of chamber
  • Can be fitted with extraction hood or nitrogen purged glove box for health and safety compliance

Power ahead with intuitive software

  • Utilising the same software platform as our trusted PlasmaPro product family, the OpAL recipe-driven, multi-user level, PC2000TM control software is easy-to-use and tailored for rapid cycle ALD.

Process Guarantees

Our customers benefit from our process guarantees; controllable, repeatable processes developed in our own applications laboratory and backed by onsite process acceptance and support.

  • Up to 200 mm wafer with typical uniformity <±2%
  • Provides excellent step coverage even inside high aspect ratio structures

ALD Tool Comparison

OpAL and FlexAL System Features:

Feature OpAL® FlexAL®
Substrates Up to 200mm wafers & pieces directly on stage Up to 200mm wafers handling and pieces on a carrier plate
Bubbled liquid & solid precursors Up to 4 plus water, ozone and gases Up to 8 plus water, ozone and gases
Max precursor source temperature 200ºC 200ºC
Mfc controlled gas lines with rapid delivery system;
1) thermal gas precursors (e.g. NH3, O2)
2) plasma gases (e.g. O2, N2, H2)
2 internally.
Up to 8 in externally
mounted gas pod
Up to 10 in externally mounted gas pod
Plasma Option/field upgrade Option
Loading Open load Loadlock or cassette
Clusterable to other process modules No Yes - inc third party MESC modules as special option
Wafer stage temperature range 25ºC – 400ºC 25ºC – 400ºC (550ºC option)
Ellipsometry ports Yes Yes
Swagelok 10ms rapid pulsing ALD valves Yes Yes



OpAL Image Gallery

OpAL with operator

OpAL with operator

OpAL, Closed

OpAL, Closed

OpAL, Open

OpAL, Open

OpAL with Wafer

OpAL with Wafer

Related Process Techniques

Atomic Layer Deposition (ALD)

Atomic Layer Deposition (ALD)

Atomic layer deposition (ALD) Oxford Instruments' ALD systems include the FlexAL and the OpAL.

Related Tools

FlexAL-montage

FlexAL ALD Tool

Remote plasma & thermal ALD in one flexible tool

Tool Support

Flexible Support Agreements

Flexible Support Agreements

Tailored Service Contracts: Choose options that suit you

System Maintenance and Process Courses

System Maintenance and Process Courses

Designed to improve system maintenance and process techniques to ensure you get the most out of your Oxford Instruments system.