Batch production solutions for the HBLED market

Oxford Instruments Plasma Technology has been the world leading supplier of high volume batch plasma tools in the production market for over 15 years, with a wide installed base of HBLED production systems in operation.

As the industry continues to evolve, we have the technology and expertise to offer the most up to date solutions to our customers.

Wafer Size Number of Wafers
  PECVD Unclamped Etch (GaN,AlGaInP) Clamped and He cooled etch (Sapphire)
6 " (150mm) 7 5 5
4 " (100mm) 15 13 12
2 " (50mm) 61 55 43

Product Features

Product Features

  • The PlasmaPro HBLED range of etch and deposition tools provides outstanding benefits for HBLED manufacturers
  • 490mm electrode giving unparalleled throughput from industry leading batch sizes of up to 7 x 6” wafers
  • High quality device performance and yield
  • Reliable hardware and ease of serviceability for excellent uptime
  • Low cost of ownership
  • Optimised for batch production, the NGP1000 has a vacuum load lock as standard, with open load and cluster capability options
  • System designed to minimise cleaning overhead

PECVD System

PlasmaPro NGP1000 PECVD System. Designed for the deposition of SiO2 and SiNx layers.

  • The NGP1000 PECVD has been specifically developed for passivation deposition in HBLED production
  • Its large area electrode and optimised showerhead design allows up to 61 x 2”, 15 x 4” or 7 x 6” wafers in a single load

Etch System

PlasmaPro NGP1000 Etch System. Designed for GaN, AlGaInP and Sapphire etch.

  • Building on over 20 years experience of compound semiconductor processing, optimised etch processes offer excellent batch throughput for all etching applications.
  • Batch sizes from 55 x 2”, 13 x 4” or 5 x 6” with cross batch uniformity of <+/-5%, yielding market leading volumes of wafers/month.

PlasmaPro NGP1000 Image Gallery

61 x 2" Wafers

61 x 2" Wafers

7x 6" Wafers

7x 6" Wafers

GaN Etch

GaN Etch

GaN Sapphire Substrate

GaN Sapphire Substrate

Sapphire Substrate

Sapphire Substrate

Related Process Techniques

ICP CVD

ICP CVD

Inductively Coupled Plasma Chemical Vapour Deposition

PECVD

PECVD

Plasma Enhanced Chemical Vapour Deposition

Tool Support

Flexible Support Agreements

Flexible Support Agreements

Tailored Service Contracts: Choose options that suit you

System Maintenance and Process Courses

System Maintenance and Process Courses

Designed to improve system maintenance and process techniques to ensure you get the most out of your Oxford Instruments system.