High Brightness LEDs (HBLEDs)
Oxford Instruments Plasma Technology (OIPT) provides production processes and tools for HBLED manufacture, offering exceptional batch and single wafer capability.
OIPT offers a unique family of process solutions for high brightness LED production, ensuring the highest possible throughput at key points in the production process.
Proven Cassette to Cassette handling technology with full wafer tracking is available for both single wafer and multi-wafer platen configurations.
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Processes
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Batch
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Single Wafer
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HBLED Processes from OIPT
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| PlasmaPro NGP1000 PECVD |
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PlasmaPro 800Plus PECVD |
Family of batch production solutions
PlasmaProTM NGP ®1000
PECVD Batch Deposition
- Production scale PECVD of passivation layers in a large batch open-loading configuration.
- SiNx and SiO2 deposition across batches of 61 x 2”, 15 x 4” and 7 x 6” wafers
PlasmaPro System133
PECVD Batch Deposition
- Load locked system enabling deposition of doped and undoped passivation on 22 x 2” and 5 x 4” batch sizes.
PlasmaPro 800Plus
PECVD Batch Deposition
- Production scale PECVD of passivation layers in a large batch open-loading configuration.
- SiNx and SiO2 deposition across batches of 43 x 2” and 11 x 4” wafers.
PlasmaPro System133 ICP380
ICP Batch Etch
- Production solution offering superb batch etch capability for high throughput.
- Sapphire etching 18 x 2” and 5 x 4”
- GaN etching 27 x 2” and 5 x 4”
- AlGalnP etching 20 x 2” and 5 x 4”.
Excellent single wafer production solutions
High throughput is maintained for single wafer, through the application of advanced technologies and processes.
PlasmaProTM
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PlasmaPro System100 |
System100Pro ICP380
ICP Etch
- Electrostatic Clamping for GaN and Sapphire substrates giving enhanced etch rates with Photoresist mask
ICP CVD and PECVD
- Fast deposition rates of high quality SiNx and SiO2. ICP CVD offers passivation at low temperatures with low damage