PlasmaProTM FA300- 300mm Failure Analysis Tool

• Excellent run-to-run reproducibility
• Laser interferometry end-point detection can be used on layer removal steps
• Multi-step recipes using laser endpoint can be written to provide a fully automated failure analysis capability for etch rate, uniformity, selectivity and profile control
• Also available as a dual-chamber tool offering dedicated process chambers for the most sensitive failure analysis application
• Excellent uniformity over 300 mm 

Click right hand side link for more information on RIE-PE process technique

Click right hand side link for more information on applicable processes

We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.

Follow right hand side link to view more information on RIE process technique

Follow right hand side link for more information on applicable processes

We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.

Oxford Instruments’ PC2000TM software is clear, easy to use, quick to learn and configured exactly for the customer’s system. Its visual interface controls and monitors the process tool, and offers the ability to control a tool cluster from a single interface and PC.

Process ‘recipes’ are written, stored and recalled through the same software, building into a process library. In cassette-to-cassette and cluster systems, the users can associate individual recipes with each wafer to be processed, and run a complete set of process steps, loops and repeats.

Password-controlled user login allows different levels of user access and tasks, from ‘one-button’ run operation to full system functions. Continuous process data logging ensures traceability of each wafer and process.