µEtch200 - 200mm Failure Analysis Tool

Plasmalab® µEtch200

µEtch200 offers market leading 200 mm process with excellent uniformity.

Its Dual mode RIE and PE deprocessing means  the PlasmalabμEtch200 is the process tool of choice for 200 mm Failure Analysis.

  • Isotropic Polyimide removal (RIE mode)
  • Isotropic SiNX removal (PE mode)
  • Anisotropic IMD/ILD etch (RIE mode) including low-K oxide
  • Decoration/delineation (cross section preparation for SEM)
  • Excellent uniformity over 200 mm
  • Clean removal of polyimide, nitride and oxide
  • Excellent run to run reproducibility
  • Higher selectivity to underlayer material
  • Sample size from small pieces up to 200 mm wafers
  • RIE 
  • RIE-PE 
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Click right hand side link for more information on RIE Process Technique 

Click right hand side link for more information on RIE-PE Process Technique 

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Related Applications & Markets

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Failure Analysis Application

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