Failure Analysis after IMD
Entry-Level Dual-mode RIE/PE Etch Tool for Failure Analysis
The Plasmalab®µEtchEL is a flexible and economic tool that offers a range of processes for Failure Analysis from isotropic passivation removal to anisotropic oxide removal, for small die or packaged devices through to 200 mm wafers.
Failure Analysis Process Applications
- Isotropic Polyimide removal (RIE mode)
- Isotropic SiNx removal (PE mode)
- Anisotropic IMD/ILD etch (RIE mode), including low-k oxide
- Decoration/delineation (cross section to prepare for SEM)
Unique Process Performance Benefits
- Outstanding uniformity over 200 mm wafers
- Clean removal of polyimide, nitride and oxide
- Excellent run to run reproducibility
- Higher selectivity to underlayer material
Click right hand side link for more information about RIE process technology
Click right hand side link for more information on Plasma Technology processes
- Dual-mode RIE/PE
- RF generator (300 W, 13.56 MHz)
- System pumped by RSV33/301BF Rootes rotary)
- 4 gas lines (CF4, CHF3, O2, Ar)
- Automatic pressure control
- Capacitance manometer (1Torr)