PECVD - Plasma Enhanced Chemical Vapour Deposition

PECVD Chamber Diagram

Plasma Enhanced Chemical Vapour Deposition (PECVD)

Key features

Top electrode RF driven (MHz and/or kHz); no RF bias on lower (substrate) electrode
Substrate sits directly on heated electrode
Gas injected into process chamber via “showerhead” gas inlet in the top electrode
0.5-1.0 Torr operating pressure
0.02-0.1 Wcm-2 power density

Benefits

Lower temperature processes compared to conventional CVD
Film stress can be controlled by high/low frequency mixing techniques
Dry plasma cleaning process with end-point control removes or reduces need for physical/chemical chamber cleaning
Control over stoichiometry via process conditions
Offers a wide range of material deposition, including:
SiOx, SiNx and SiOxNy deposition for a wide range of applications including photonics structures, passivation, hard mask, etc.
Amorphous silicon (a-Si:H)
TEOS SiO2 with conformal step coverage, or void-free good step coverage
SiC
Diamond-like carbon (DLC)

PECVD Tools from Oxford Instruments

Feature	System80Plus	System800Plus	System100	System133
Electrode size	240mm	460mm	240mm	330mm
Loading	Open Load	Open Load	Load locked	Load locked
Substrates	See product brochure	See product brochure	200mm with carriers options available for multi-wafers or small pieces	300mm with carriers options available for multi-wafers or small pieces
Dopants	No	No	Various dopants available which include PH3, B2H6, GeH4	Various dopants available which include PH3, B2H6, GeH4
Liquid Precursors	No	No	Yes: TEOS	Yes: TEOS
MFC controlled gaslines	8 or 12 line gas box available	8 or 12 line gas box available	8 or 12 line gas box available	8 or 12 line gas box available
RF Switching for Stress Control	Yes	Yes	Yes	Yes
Wafer stage temperature range	20°C to 400°C	20°C to 400°C	Standard 20°C to 400°C with option for upto 800°C	Standard 20°C to 400°C with option for upto 700°C
Insitu plasma clean	Yes	Yes	Yes. Endpoint available to ensure optimum clean time	Yes. Endpoint available to ensure optimum clean time

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Load Locked Tool

Open Load Tool for PECVD

Open Load Tool for PECVD

Load Locked Tool for PECVD

Load Locked Tool for PECVD