HR-TEM picture, 200kV, elastically filtered
taken by TU Chemnitz, showing the interface
of a 200 nm amoprhous DLC film deposited
on a Si wafer at the OPT application lab
DLC stands for "diamond like carbon". It is used as a protective coating and for very high quality electrical passivations layers
Related Products:
System100 System133 System 80Plus System800Plus
- Good adhesion on Si, polymers, SiO2
- Rate: 15 - 50 nm/ min
- Uniformity per wafer: ± 3/ 5 % (4/ 6")
- Low deposition temperature
- Refractive index 2.4
- High electrical breakdown field
- Dielectric constant approx. 8
- Semiconducting devices become radiation hard
- Doping with nitrogen or boron possible
- Thermal conductivity variable, up to 700W/m-K
- Moh hardness: 9
- Vickers microhardness 2000-5000 kg/mm2