ITO Deposition - Indium Tin Oxide Deposition - Magnetron Sputtering

Plasmalab®System400 magnetron sputtering
process tool for physical vapour deposition (PVD)

Related Product: System 400

Technology:

• Magnetron Sputtering rotating table electrical table heating
• ITO Target 90% In 2O3 + 10% SnO2
• Sputtering gas Ar
• Additional gas Oxygen pulsed DC magnetron mode
• Average Optical Transmission at 400-1200 nm > 90 %
• Deposition Rate 2 - 30 nm/min
• Resistivity < 4x 10-4 ohm cm
• Uniformity < ± 5 % over 150 mm (without uniformity mask, uniformity masks improve the uniformity at the expense of rate.)
• Surface Roughness Ra < 2 nm
• Refractive Index 1.95—2.10 dependent on the O2 flow