HBLEDs: How Oxford Instruments is shaping the future
Lighting is one of those things we take for granted, but it forms an integral part of our daily lives, impacting enormously both on us and our environment. Mark Dineen PhD, Principal Applications Engineer, OIPT describes how Oxford Instruments is playing an increasingly important role in the manufacture of HBLEDs, enabling huge changes in the global lighting industry.
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MEMS – Fabrication of silicon micro-needles using isotropic and anisotropic plasma etching techniques for biomedical applications
When people think of the term MEMS (Micro-electro-mechanical-systems) it generally conjures up images of micro sized turbines, motors and accelerometers. However, when applied to the field of BioMEMS (MEMS for use in biomedical situations), most individuals would struggle to imagine many current applications. Dean Stephens, Senior Applications Engineer, OIPT explains how micro-needles for pain-free drug use (for the transdermal delivery of drugs or, conversely, blood sampling) can be fabricated, using a PlasmalabSystem100 ICP380 etch tool.
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High deposition rate processing using ICP-CVD
Deposited films such as Silicon nitride and silicon oxide are used in HBLEDs to passivate the final devices. Here Owain Thomas PhD, Senior Applications Engineer at OIPT describes the recent advances that have shown the capability of ICP-CVD in achieving high quality films at low temperatures with high throughput. Due to these additional benefits of ICP-CVD several HBLED manufactures are now considering the ICP-CVD technique as an alternative to conventional PECVD.
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Successful ‘Plasma Etch Tech 2008’ seminar and workshop at Caltech
The Kavli Nanoscience Institute, California Institute of Technology held a highly successful seminar and workshop in July 2008 at the Caltech, California facility with Oxford Instruments. The wide and varied programme proved to be a huge success, and participant numbers exceeded all expectations.
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Hydride Vapour Phase Epitaxy (HVPE)
Larry Leung PhD, Product Manager, TDI introduces the newly acquired company, explains Hydride Vapour Phase Epitaxy (HVPE) and its advantages, and describes the offerings from TDI including the Nitride-based Templates the company produces.
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Low loss, high quality optical coatings using Ionfab®500Plus
A high quality optical coating should have low optical loss. Losses inside an optical coating arise from scatter and absorption. In this article, Sebastien Pochon PhD, Applications Engineer, OIPT describes how ion beam sputtering produces films with total losses so low that sophisticated devices are needed to measure them. Data for the measurement of mirrors with losses less than 2ppm have been published by two independent groups. Both groups made their mirrors on Oxford Instruments Ion beam sputter deposition systems – the IonFab500Plus.
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Transparent Conductive Films
Oxford Instruments Plasma Technology has developed a DC magnetron sputter deposition process that will be useful in various applications requiring good optical transmission and low resistivity. The process can be easily controlled by varying several process parameters in order to achieve optimum film properties. Knut Beekmann, Technologist and Saleem Shabbir, Applications Engineer, OIPT explain the dramatic growth in interest in transparent conductive oxides or TCOs seen in recent years.
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OIPT Wins Significant orders in the Russian market
Oxford Instruments, the high-technology tools and systems company, has won orders for 6 systems to equip a number of research & development facilities and manufacturing plants in Russia. The 6 systems ordered include both plasma deposition tools, and an Ionfab® ion beam system.
Mark Vosloo, Sales Director for Oxford Instruments Plasma Technology comments, “We are extremely pleased to have entered the Russian market so successfully over the past few years, and these new orders only emphasise our ability to establish ourselves in an evolving marketplace. This is a very significant order for us, not only commercially, but also as an endorsement of Oxford Instruments’ position at the forefront of providing high quality, innovative process tools which are enabling the next generation of electronic and nanotechnology devices.”
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LATEST UPGRADES - Plasma Accelerator for Failure Analysis
The latest upgrade for dry etch deprocessing in semiconductor failure analysis (FA), the Plasma Accelerator for advanced die processing, has recently been released.
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