The latest upgrade for dry etch deprocessing in semiconductor failure analysis (FA), the Plasma Accelerator for advanced die processing, has recently been released.
The Plasma Accelerator delivers increased etching speeds, simple operation and low damage. It supports a full range of dry-etch FA processes, including passivation removal, IMD (inter-metallic dielectric) and ILD (inter-layer dielectric) etch, ensuring a clean, smooth etched surface is produced with no metal de-lamination or erosion.