Photovoltaics: Sputtered TCO Process Development
Author: Knut Beekmann, Photovoltaics Product Manager, OIPT
Oxford Instrument Plasma Technology has introduced a single wafer sputtering system in addition to the PlasmalabSystem400 batch sputterer.
The module has been designed to be integrated into a cluster configuration and used for PV applications such as TCO deposition using reactive DC magnetron sputtering. The system is available to process substrate sizes up to 156mm square at temperatures of up to 400°C. Processes for Indium Tin Oxide have been developed and show similar film properties to those achieved on the System400.
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New FlexAL Features
Author: Chris Hodson, ALD Product Manager, OIPT
Listening to feedback from current FlexAL customers and following our own development roadmap a number of enhancements and new features are available for FlexAL.
These include:
• Increased number of rapid bubbled metal liquid or solid precursors from 4 to 8
• Increased precursor and operating temperatures
• Rapid delivery system for plasma and thermal gases
• Enhanced chamber liners, forming an inner chamber
• Ozone delivery
• Integrated mass spectrometry to complement the integrated ellipsometry
• Enhanced software interface for users new to ALD
Many of these features are available as upgrades for existing FlexAL customers. Contact your local OIPT Sales Manager for more details.
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Strengthening OIPT’s Etch Capability for the HBLED Market
Author: Mark Dineen, PhD, Principal Applications Engineer, OIPT
Building on our established reputation for market leading etch hardware, the team at OIPT has developed an evolution of the System 133 RIE-ICP380 tool. The new technology is an active spacer that improves the uniformity of the plasma across the electrode, giving excellent etch results both within wafer and cross batch. A key benefit is that it allows an increase in batch size from 20 x 2” GaN wafers to 27 x 2”, or a mammoth 7 x 4” GaN and 18 x 2” Sapphire wafers.
OIPT’s new spacer offers uniformity tuning at will, which simplifies the process. This allows enhanced process performance and higher throughput, which is essential for our production customers. The spacer is retrofittable to our systems in the field. OIPT’s well proven System 133 Process Module is built on a 300mm platform, with multi-batch capability, and with processes guaranteed to ensure rapid start up during installation. It may be clustered to combine technologies and processes, offering maximum flexibility. With an installed base of over 2000 tools worldwide, OIPT tools boast over 90% uptime.
This new technology is being investigated for other process applications with promising results.