This regular newsletter from Oxford Instruments Plasma Technology (OIPT) includes articles on some of the exciting work the company is doing in process and tool innovation. We pride ourselves on the leading edge processes that we develop and continually refine at OIPT, but without the innovative research and demanding production requirements of our customers, these processes wouldn’t be developed and we wouldn’t be constantly challenged to improve them.
Enjoy your read!
Carbon Nanotubes and Semiconductor Nanowires for Microelectronics
Francesca Iacopi, Senior Scientist with the Nano group at IMEC, Belgium, recently gave a talk at OIPT's Seminar at Southampton University.
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M. David Henry and colleagues at the Applied Physics Laboratory, California Institute of Technology have written an article, from a talk given at the LBNL Seminar in July.
Author: Dr Cigang Xu, Development Scientist at OIPT
There is great interest in the growth, functionalisation and application of carbon nanotubes.
Author: Andy Goodyear, Principal Applications Specialist, OIPT
A CCD Spectrometer is an extremeley useful additionto any plasma tool, since it can provide not only a process endpointing capability, but also a large amount of plasma spectroscopy information - used for monitoring the species within plasma.
Dr Mike Cooke, Chief Technology Officer at OIPT examines why panels need to enclose a machine.
Apart from style, he says there are important reasons to care about the panels, many of them affecting machine safety.
New Flexal features
Listening to customer feedback from current Flexal customers and following our own development roadmap, a number of enhancements and new features are available for Flexal.
Strengthening OIPT's Etch Capability for the HBLED Market
Mark Dineen, Principal Applications Engineer at OIPT explains how the team at OIPT has built on our established reputation to develop an evolution of the System133 RIE-ICP tool.
Photovoltaics: Sputtered TCO Process Development
Oxford Instruments has introduced a single wafer sputtering system in addition to the PlasmalabSystem400 batch sputterer.
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