PlasmaProTMNGP®1000 Large Batch Next Generation Plasma System

7 x 6" Wafers - click for larger image

 

 

 

  

 

7x 6" Wafers

61 x 2" Wafers

 
Batch production solutions for the HBLED market

Oxford Instruments Plasma Technology has been the world leading supplier of high volume batch plasma tools in the production market for over 15 years, with a wide installed base of HBLED production systems in operation.

As the industry continues to evolve, we have the technology and expertise to offer the most up to date solutions to our customers.

Wafer Size

Number of Wafers

 

PECVD

Unclamped Etch GaN,AlGaInP)

Clamped and He cooled etch (Sapphire)

6 " (150mm)

7

5

5

4 " (100mm)

15

13

12

2 " (50mm)

61

55

43

 

 

 

 

 

 

 

 

  • Features 
  • Images 
  • PECVD System 
  • Etch System 
  •  

Features

  • The PlasmaPro HBLED range of etch and deposition tools provides outstanding benefits for HBLED manufacturers
  • 490mm electrode giving unparalleled throughput from industry leading batch sizes of up to 7 x 6” wafers
  • High quality device performance and yield
  • Reliable hardware and ease of serviceability for excellent uptime
  • Low cost of ownership
  • Optimised for batch production, the NGP1000 has a vacuum load lock as standard, with open load and cluster capability options
  • System designed to minimise cleaning overhead

 

 

 

Fully etched Patterned Sapphire Substrate, PR fully removed

Patterned Sapphire Substrate for GaN growth

Typical GaN etched feature, PR remains intact

61 x 2" Wafers - click for larger image

 

 

 61 x 2" Wafers

PlasmaPro NGP1000 

PlasmaPro NGP1000
Next Generation Plasma System

 

PlasmaPro NGP1000 PECVD System
Designed for the deposition of SiO2 and SiNx layers.

The NGP1000 PECVD has been specifically developed for passivation deposition in HBLED production. Its large area electrode and optimised showerhead design allows up to 61 x 2”, 15 x 4” or 7 x 6” wafers in a single load.

PlasmaPro NGP1000 Etch System
Designed for GaN, AlGaInP and Sapphire etch.

Building on over 20 years experience of compound semiconductor processing, optimised etch processes offer
excellent batch throughput for all etching applications. Batch sizes from 55 x 2”, 13 x 4” or 5 x 6” with cross batch uniformity of <+/-5%, yielding market leading volumes of wafers/month.

Contact Us

Related Products

Related Applications & Markets

Downloads And Links