Deep Silicon Etch System, the PlasmaPro Estrelas100

Developed with the R&D market in mind, the PlasmaPro Estrelas100 offers the ultimate in process flexibility. Nano
and micro structures can be realised as the hardware has been designed with the ability to run Bosch™ and cryo etch technologies in the same chamber.

From smooth sidewall processes to high etch rate cavity etches, the PlasmaPro Estrelas100 has been designed to ensure that the wide range of MEMS applications can be realised without the need to change the chamber hardware.

• Compatible with 50mm to 200mm ensures that you have the ability to develop devices that can be taken to production using the same chamber hardware.
• Mechanical and electrostatic clamp
• Heated liners
• Increased plasma stability, eliminating ‘first wafer effect’
• Reduced polymer build up, increasing the mean wafers between mechanical cleans
• Fast acting closed coupled MFCs utilising software originally designed for atomic layer deposition
• Reduced chamber volume ensuring high gas conductance
• Low Cost of Ownership through optimised hardware and process control