Atomic Layer Deposition System - FlexAL

FlexAL® systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single ALD system to deliver:

  • Maximum flexibility in the choice of materials and precursors
  • Low-temperature processes enabled by plasma ALD
  • Low damage maintained by the use of remote plasma
  • Controllable, repeatable processes via recipe-driven software interface
  • Benefits 
  • System Features 
  • Wafer Handling 
  • Precursor Delivery 
  • Applications 

FlexAL System Benefits:

  • Ability to handle from small wafer pieces up to full 200 mm wafers
  • Load-locked wafer entry for safety, low particle count and short loading-to-process-start time
  • Unique precursor delivery system offering precise precursor temperature control with fan-assisted oven and optimised heated delivery lines
  • Integral glove box on precursor modules for in-situ change-over
  • Integral ports to allow the addition of in-situ ellipsometry measurement tools
  • Fits in compact space of less than 2 x 2 m even with maximum number of precursor modules
  • May be integrated in cluster system with other process tools, including Oxford Instruments PlasmalabSystem100 range of etch and deposition tools
  • Backed by Oxford Instruments' global sales and support network; with platform technology based on the popular PlasmalabSystem100 process tool, the FlexAL product family benefits from proven reliability in over 300 installed systems worldwide
  • Developed in consultation with leading atomic layer deposition (ALD) experts in Europe, Korea and USA
  • Licensed technology from ASM International NV

Key Features

  • Remote plasma & thermal ALD in one flexible tool
  • Automated 200mm load lock for process flexibility
  • Clusterable for vacuum transfer of substrates
  • Cassette to cassette handling increases throughput suitable for production
  • Click right hand link to view our applicable processes

We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.

Comparison - FlexAL and OpAL:

Feature

  OpAL  FlexAL 
Substrates Up to 200mm wafers & pieces directly on stage Up to 200mm wafers handling and pieces on a carrier plate
Bubbled liquid & solid precursors Up to 4 Up to 8
Max precursor source temperature 200ºC (Jacket) 200ºC (Oven & jacket)
Additional Precursors Water + ozone Water + ozone
Mfc controlled gas lines with rapid delivery system;
1) thermal gas precursors (e.g. NH3, O2)
2) plasma gases (e.g. O2, N2, H2)		 2 internally.
Up to 8 in externally
mounted gas pod		 Up to 10 in externally mounted gas pod
Plasma Option/field upgrade Option
Loading Open load Loadlock or cassette
In situ diagnostic ports Ellipsometry, QCM, OES, QMS (on foreline) Ellipsometry, QCM, OES, QMS
Clusterable to other process modules No Yes - inc third party MESC modules as special option
Wafer stage temperature range

25ºC – 400ºC (500ºC option)

25ºC – 400ºC (550ºC option)

Ellipsometry ports Yes Yes
Swagelok 10ms rapid pulsing ALD valves Yes Yes
Removable inner chamber Yes Yes
PC2000 rapid control software Yes Yes

FlexAL Wafer HandlingFlexAL wafer handling options:

  • Single wafer loadlock
  • Square handler clustered to other process modules, e.g. PlasmalabSystem400 sputter deposition
  • Hex handler with robot and 25 wafer cassette for 4”, 6” or 8” wafers (no tools required to swap between wafers)
  • All configurations can be located entirely within the cleanroom or through-the-wall

FlexAL Precursor Delivery:

  • Multiple liquid or solid precursor delivery systems
  • Vapour draw or bubbling up to 200ºC source temperature
  • Rapid gas delivery
  • Extracted precursor enclosures with attachable glove box for use during precursor changeover

FlexAL Applications

    • Nano-electronics
    • High-k gate oxides
    • Storage capacitor dielectrics
    • High aspect ratio diffusion barriers for Cu interconnects
    • Pinhole-free passivation layers for OLEDs and polymers
    • Passivation of crystal silicon solar cells
    • Highly conformal coatings for microfluidic and MEMS applications
    • Coating of nanoporous structures
    • Bio MEMS
    • Fuel cells
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