PlasmaProTM NGP80 - Next Generation Plasma System

PlasmaPro NGP80 is suited to a wide range of applications

• III-V etch processes
• Silicon Bosch and cryo-etch processes
• Diamond Like Carbon (DLC) deposition
• SiO2 and quartz etch
• Failure analysis dry etch de-processing using the specially-configured PlasmaPro NGP FA tools, with RIE, dual-mode RIE/PE and ICP processes ranging from packaged chip and die etch through to full 200mm wafer etch
• High quality PECVD of silicon nitride and silicon dioxide for photonics, dielectric layers, passivation and many other uses
• Hard mask deposition and etch for high brightness LED production

High performance processes

• PlasmaPro NGP80 optimised electrode cooling results in excellent process control, wafer temperature uniformity and great flexibility, covering a wide range of processes.
• Enhanced process uniformity and rates are guaranteed by using a high-conductance radial (axially symmetric) pumping configuration
• The addition of < 500ms datalogging of the capacitor values offers traceability and history of chamber and process conditions
• A close-coupled turbo pump provides high pumping speed and excellent base pressure

Process Control – Etch end point detection

PlasmaPro NGP80 End Point

Excellent etch control and rate determination can be provided by optional end-point detection, integrated with PC4000TM process tool software.

• Laser end-point detection using interferometry to measure etch depth in transparent materials on reflective surfaces (for example, oxides on Si), or reflectometry for non-transparent materials (such as metals) to determine layer boundaries
• Optical emission spectrometry (OES) for large sample or batch process end-pointing by  detecting changes in etch by-products or depletion of reactive gas species, and for chamber clean end-pointing

PlasmaPro NGP80 Gas Control System

Gas Control System

• A modular upgrade path for gas lines enables users to maximise the flexibility of the PlasmaPro NGP80 system. The remote gas line by-pass facility allows broad functionality & ease of use.

PC4000 Software user interface

Process tool software

PlasmaPro NGP80 includes a new and improved user interface based on tried and tested software. Oxford Instruments software is renowned for its clarity and ease of use, making it quick to train process operators while retaining full functionality for fab managers and service staff.

• The front end visual interface, which controls and monitors the process tool, is configured exactly for the customer’s system
• Process recipes are written, stored and recalled through the same software, building a library
• Password controlled user login allows different levels of user access and tasks, from ‘one-button’ run operation to full system functions
• Continuous system data logging (< 500ms) ensures effective traceability of each wafer and process run
  Fully GEM/SECS compatible

Cost of ownership and customer support

We work with our customers to create the right system, process, and support package to meet your specific requirements, so our range of Service Level Agreements (SLA) will be tailored to your needs. This can include:

• Guaranteed response times for support engineer visits and technical hotline calls
• Choice of support coverage up to 24/7
• Scheduled preventative maintenance calls
• Managed spares inventory options, including customer dedicated stock, via our parts locations worldwide
• Preferential spare part pricing
• Process training
• Certified maintenance training courses for customer’s own engineers in preventative maintenance and first level troubleshooting