Open Load Atomic Layer Deposition (ALD) System - OpAL

OpAL ALD System Benefits:

• Vapour draw or bubbling of up to four liquid or solid precursors
   
• Can be fitted with a nitrogen purged glove box with sample entry load lock for dry environment
• Easily detachable liners reduce chamber cleaning times
• In-situ analytical options including spectroscopic ellipsometry linked into ALD control software

Power ahead with intuitive software

• Utilising the same software platform as our trusted PlasmaPro product family, the OpAL recipe-driven, multi-user level, PC2000TM control software is easy-to-use and tailored for rapid cycle ALD.

Example ALD applications:

• Nano-electronics
• High-k gate oxides
• Storage capacitor dielectrics High aspect ratio diffusion barriers for Cu interconnects
• Pinhole-free passivation layers for OLEDs and polymers
• Passivation of crystal silicon solar cells
• Highly conformal coatings for microfluidic and MEMS applications
• Coating of nanoporous structures
• Bio MEMS
• Fuel cells

Our customers benefit from our process guarantees: controllable, repeatable processes developed in our own applications laboratory and backed by onsite process acceptance and support.

• Up to 200 mm wafer with typical uniformity <±2%
• Provides excellent step coverage even inside high aspect ratio structures
• Offers superb thin film barrier properties
• Low carbon contamination of Al2O3 (AES)
• Amorphous, pin-hole free Al2O3 (TEM)
• Excellent uniformity of HfO2, < ±2% on a 200 mm wafer (Spectroscopic Ellipsometry)

OpAL and FlexAL System Features:

Safety Features:

•  Cabinet can be fitted to extraction lines and has nitrogen purge for assured health and safety compliance
•  Pneumatic hoist for safe opening of chamber
•  Can be fitted with extraction hood or nitrogen purged glove box for health and safety compliance