Plasma Etch & Deposition Tool for R&D - PlasmaPro System100

Plasmalab®System100 plasma etch & deposition tool

PlasmaProTM System100 is a flexible and powerful solution for plasma etching and deposition processes.

The load-locked wafer entry allows fast wafer exchange, the widest range of process gases and an extended process temperature range.
Allowing maximum process flexibility for compound semiconductor, optoelectronics, photonics, MEMS and microfluidics applications, the PlasmaPro System100 plasma etcher and deposition tool can have many configurations.

Images
Process Techniques
System Features
Processes
Support

PlasmaPro System100 detail - Click for larger image

PlasmaPro System100 Research System - Click for larger image

PlasmaPro System100 - Click for larger image

PlasmaPro System100 ICP - Click for larger image

PlasmaPro System100 Process Techniques:

Inductively Coupled Plasma (ICP)
Inductively Coupled Plasma Chemical Vapour Deposition (ICP CVD)
Plasma Enhanced Chemical vapour deposition (PECVD)
Reactive Ion Etch (RIE)

Key features:

8" wafer handling, also allowing small batch (6 x 2") pre- and pilot production capability
Options of single wafer/batch or cassette loading
Can be integrated into a cluster system with central robotic wafer handler and full cassette-to-cassette wafer handling for production processes.
Substrate temperature control is provided by a range of electrodes, with a temperature range of -150 °C to +700 °C
Endpoint detection by laser interferometry and/or optical emission spectroscopy can be fitted to enhance etch control
Options of a 6- or 12-line gas pod provides flexibility in processes and process gases, and may be remotely sited in the service area, away from the main process tool

PECVD tool:	RIE tool:
13.56 MHz driven parallel plate reactor kHz and "frequency mixing" optional Shower head gas inlet optimised for PECVD 400° C and 700° C substrate electrodes	13.56 MHz driven parallel plate reactor Cooled substrate electrodes Shower head gas inlet optimised for RIE High conductance vacuum layout

Processes

Some examples of processes available using PlasmaPro System100 plasma etch & deposition tool:

Cryo Si etch, Bosch deep Si etch and SOI processes for MEMS, microfluidics and photonics
III-V etch processes for laser facets, via holes, photonic crystals and many other applications in a wide range of materials (InP, InSb, InGaAsP, GaAs, AlGaAs, GaN, AlGaN, etc.)
Pre-production and R&D process for GaN, AlGaN, etc. etching for HB LEDs and other power devices
High quality and high rate SiO2 deposition for photonics applications
Metal (Nb, W) etch

- A Global Reach

Oxford Instruments is committed to supporting our customers’ success. We recognise that this requires world class products complemented by world class support. Our global service force is backed by regional offices, offering rapid support wherever you are in the world.

Service Centres*

Parts Centres

Europe & Middle East

Montevrain, France
Wiesbaden, Germany
Haifa, Israel
St Petersburg, Russia
Moscow, Russia
Bristol, UK

USA

Arizona, USA
Texas, USA
San Francisco, CA, USA
Concord, MA, USA

Asia

Beijing, China
Guangzhou, China
Shanghai, China
Hong Kong
New Delhi, India
Mumbai, India
Calcutta, India
Bangalore, India
Tokyo, Japan
Kyungki-do, Korea
Penang, Malaysia
Singapore
Taiwan County, Taiwan

Asia

Shanghai, China
Taiwan County, Taiwan

EMEA

Bristol, UK

USA

Concord, MA, USA

*Includes agents with OIPT trained engineers

For information on our Flexible Support Agreements please visit our Support pages

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