System80Plus Open-Loading Plasma Etch & Deposition Tool

A flexible, compact and economical solution for plasma etching and deposition processes. Allowing maximum process flexibility for compound semiconductor, optoelectronics, photonics, MEMS and microfluidics applications, the Plasmalab80Plus can be configured for inductively coupled plasma (ICP) etching and deposition (ICP-PECVD), reactive ion etching (RIE), plasma etching (PE) or plasma enhanced chemical vapour deposition (PECVD). The open load design allows for fast loading and unloading, ideal for prototyping and low volume production environments.

Processes:

Contact us for details in our process performance datasheets, for example:

• Si cryo etch and Bosch deep Si etch for MEMS, microfluidics, Si waveguides, etc
• SiO2, SiNx NH3-free SiNx deposition and etch for hard mask, passivation, etc
• RIE of III-V photonics
• ICP-PECVD for low-temperature deposition of SiO2 and SiNx

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System 80Plus Process Techniques

• Reactive Ion Etch (RIE)
• Reactive Ion Etch - Plasma Enhanced (RIE-PE)
• Plasma Enhanced Chemical Vapour Deposition (PECVD)
• Inductively Coupled Plasma Etch (ICP)

 

We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.

 - A Global Reach

Oxford Instruments is committed to supporting our customers’ success. We recognise that this requires world class products complemented by world class support. Our global service force is backed by regional offices, offering rapid support wherever you are in the world.

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 For information on our Flexible Support Agreements please visit our Support pages