Deposition and growth

Deposition and growth

Oxford Instruments offers a range of process solutions for deposition and growth of advanced materials for semiconductor, optoelectronic, photonics, MEMS and other nanotechnology applications.

Our range of solutions encompasses:

• Plasma-enhanced thin film deposition
• Plasma-enhanced chemical vapour deposition (PECVD) for deposition of SiO₂, SiN_x and SiO_xN_y in a wide range of applications
• Inductively-coupled plasma chemical vapour deposition (ICP-CVD), offering lower processing temperatures than PECVD
• Atomic layer deposition (ALD) for ultra-thin film deposition, with highly conformal (~100%), pinhole-free coverage of a wide range of oxides, nitrides, single element metals and nanolaminates materials
• Physical vapour deposition offering the flexibility of dc or rf magnetron sputtering for batch or single-wafer PVD processing in production or research & development
• PECVD growth of nanomaterials
• carbon nanotubes (CNT)
• nanowires
• Molecular beam epitaxy (MBE) for the expitaxial growth of III-V, II-VI and nitride materials
• Ion beam deposition for a wide range of materials and for ultra high-quality optical coatings (high reflectance and anti-reflectance)
• Ion beam sputter deposition (IBSD)
• Ion assisted sputter deposition (IASD)
• Reactive ion beam deposition (RIBD)

Please select from the list of sub-applications within our "Product Finder" to help you locate the correct product, or choose from the list of "Related Products" in the section beneath it. Alternatively, please contact us to discuss your need, and our expert sales and applications staff will be pleased to help you select the right process and tools to meet your requirements.