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Applications in Microelectronics
Microstructures, especially texture and boundary characteristics, play an essential role in determining the suitability of many components for microelectronic applications. Therefore the EBSD technique, with its powerful combination of high spatial resolution and comprehensive characterisation, is an ideal technique for analysing microelectronic materials. In these application notes a variety of materials have been analysed using EBSD and forescatter imaging, demonstrating the potential of the technique in this field.
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- Growth direction and orientation analysis of nanostructures by EBSD
613(Kb)
- Analysing small orientation changes in GaN buffer layers
759(Kb)
- Characterising Tantalum thin films
1331(Kb)
- High resoultion EBSD analyses of Cu - interconnects
949(Kb)
- Improving the processing of high temperature superconductors by texture control
4557(Kb)
- Solar cells from chalcopyrite-type thin films analysed by electron backscatter diffraction
503(Kb)
- Studying grain populations in PZT ceramics
1207(Kb)
- Texture and boundary analysis in Cu - thin film
3623(Kb)