FlexAL^® atomic layer deposition (ALD) tool

FlexAL® atomic layer deposition (ALD) tool

Oxford Instruments’ FlexAL product family provides a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single system to deliver:

Maximum flexibility in the choice of materials and precursors
Low-temperature processes enabled by plasma ALD
Low damage maintained by the use of remote plasma
Controllable, repeatable processes via recipe-driven software interface

Processes

Standard processes available on the FlexAL systems include:

Al2O3 remote plasma process - down to room temperature deposition

HfO2 high-k dielectric remote plasma process

HfO2 high-k dielectric thermal ALD process

TiN remote plasma process

Unique system benefits

Ability to handle from small wafer pieces up to full 200 mm wafers
Load-locked wafer entry for safety, low particle count and short loading-to-process-start time
Unique precursor delivery system offering precise precursor temperature control with fan-assisted oven and optimised heated delivery lines
Integral glove box on precursor modules for in-situ change-over
Integral ports to allow the addition of in-situ ellipsometry measurement tools.
Fits in compact space of less than 2 x 2 m even with maximum number of precursor modules
May be integrated in cluster system with other process tools, including Oxford Instruments Plasmalab®System100 range of etch and deposition tools
Backed by Oxford Instruments' global sales and support network; with platform technology based on the popular PlasmalabSystem100 process tool, the FlexAL product family benefits from proven reliability in over 300 installed systems worldwide
Developed in consultation with leading atomic layer deposition (ALD) experts in Europe, Korea and USA
Licensed technology from ASM International NV

Product range

The FlexAL atomic layer deposition tool is available as:

FlexALRPT offering both remote plasma and thermal ALD in a single system to provide a wide choice of precursors and processes
FlexALRPX offering the widest range of precursor options within both remote plasma and thermal ALD, having the maximum number of precursor delivery modules and deposition temperatures up to 700 ºC

FlexAL remote plasma atomic layer deposition (ALD) tool

Al2O3 by remote plasma atomic layer deposition (ALD)

100% conformality of 80 nm thick Al2O3 film deposited by remote plasma ALD in 2.5 µm wide trenches with an aspect ratio of 10:1. Courtesy of Eindhoven University of Technology and Philips Research

FlexAL^® atomic layer deposition (ALD) tool