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Plasmalab®µEtch300 failure analysis dry etch tool
Dual-mode RIE/PE 300 mm etch tool for FA de-processing
By offering dual-mode RIE and PE dry etch de-processing in a single compact system, the PlasmalabµEtch300 is the process tool of choice for 300 mm failure analysis, performing multiple FA steps:
- Polyimide removal (RIE mode)
- Depassivation (PE mode)
- IMD etch (RIE mode) including low-k oxides
- Decoration/delineation
Key benefits
- Excellent uniformity over 300 mm
- Clean removal of polyimide, nitride and oxide
- Excellent run-to-run reproducibility
- Laser interferometry end-point detection can be used on layer removal steps
- Multi-step recipes using laser endpoint can be written to provide a fully automated failure analysis capability for etch rate, uniformity, selectivity and profile control
- Also available as a dual-chamber tool offering dedicated process chambers for the most sensitive failure analysis applications
Processes
Please contact us to request our process performance datasheets for full process details.
We work closely with our customers to develop new and customised processes according to their application needs; please contact us for details.
Plasmalab®µEtch300 dual-mode RIE/PE 300 mm etch tool for FA de-processing
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NEW - Plasma Accelerator for FA in advanced die etch processes
Up to 20 times faster etching rates with the Failure Analysis Plasma Accelerator upgrade for RIE and ICP FA de-processing Click here or in Downloads and Links below
Process News
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Downloads and Links
- Failure Analysis application brochure
(1,780Kb)
- Failure analysis plasma accelerator upgrade
(293Kb)
- PlasmalabSystem100Pro Brochure
(1,598Kb)