White Paper: High yield manufacturing of mesas in GaAs based VCSELs
The current demands from optical interconnect, LIDAR technology or face recognition is driving the VCSEL industry to grow faster. VCSEL manufacturing is rapidly scaling up across the world and the VCSEL fabrication process has to achieve ever higher yield and quality.
With a strong process expertise and extensive device understanding, Oxford Instruments Plasma Technology has developed advanced plasma processing solutions to deliver the device performance and yield demanded by the VCSEL market. In this white paper, we focus on how to best control the geometry of the mesa for wafer size up to 150mm. We review the key requirements for achieving either a tapered or vertical profile with precise control of the depth of the mesa.