Andy Goodyear & Dr Mike Cooke, Oxford Instruments Plasma Technology
ALE is becoming increasingly popular for the etching of thin layers with low damage, high precision and excellent selectivity. It has particular relevance to the etching of 2D materials.
We have developed an optimised etch tool for well controlled ALE. This includes fast gas dosing for accurate delivery of dosing gas, combined with precise delivery of RF power to the substrate for optimum control of DC bias.
Switching between ALE and conventional etching is controlled from software, allowing ALE and conventional etch modes in the same process recipe.
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