ALD 2014

Kyoto, Japan
15 - 18 June 2014
Businesses Attending:
Plasma Technology

The AVS Topical Conference on Atomic Layer Deposition 2014 (ALD 2014) will be a three-day meeting, (preceded by one day of tutorials) dedicated to the science and technology of atomic layer controlled deposition of thin films. In every year since 2001 at Monterey, the conference had been held alternatively in United States, Europe, and Asia allowing fruitful exchanges of scientists’ ideas, know-hows, and practices.

Atomic Layer Deposition (ALD) is used to fabricate ultrathin and conformal thin film structures for many semiconductor and thin film device applications. A unique attribute of ALD is that it uses sequential self-limiting surface reactions to achieve control of film growth in the monolayer or sub-monolayer surface thickness regime. ALD is receiving attention for its potential applications from semiconductor leading-edge technologies, advanced microsystems, displays to energy capture and storage, solid state lighting, biotechnologies, and security. ALD is particularly advantageous for any advanced technologies that require control of film structure in the nanometer or sub-nanometer scale.

This conference offers an excellent opportunity to learn about the most recent R&D activities in ALD science and technology from researchers around the world.

Had a great evening yesterday, networking with low temperature physicists over a reception at DPG Spring Meeting, s…
5:48 PM - 15 Mar 18
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