Industry leading processes and tools for FA dry etch de-processing

Oxford Instruments' flexible Failure Analysis (FA) tools allow a whole range of processes, from passivation removal to anisotropic oxide removal, from small die or packaged devices through to 300mm wafers

Benefits of our Failure Analysis tools:

  • Flexible processes using either RIE/PE or ICP platform
  • Advanced die process: Etch rate 20 times faster than standard RIE processes using the Plasma Accelerator
  • Flexible tools offering a whole range of processes

Range of Failure Analysis tools available:

  • PlasmaPro FA300 - a dual-mode RIE/PE tool for 300mm wafer processing
  • PlasmaPro FA200 ICP - a fast and low damage tool for small die and packaged devices
  • PlasmaPro FA200 - a dual-mode for 200mm wafer processing
  • TEOS - process for gap fill
     

Products For This Application

Particle analysis in the SEM - AZtecFeature

Particle analysis in the SEM - AZtecFeature

Particle analysis in SEM, specifically optimised for ease-of-use and high-speed sample throughput

Thin film analysis in the SEM: LayerProbe

Thin film analysis in the SEM: LayerProbe

LayerProbe is a thin film analysis tool tool that measures the thickness and composition of multiple layers in thin film structures in the SEM. It is an extension to AZtec EDS analysis.

Thin film analysis in the SEM: LayerProbe

Thin film analysis in the SEM: LayerProbe

LayerProbe is a thin film analysis tool that measures the thickness and composition of multiple layers in thin film structures in the SEM. It is an extension to AZtec EDS analysis.

Particle analysis in the SEM - AZtecFeature

Particle analysis in the SEM - AZtecFeature

AZtecFeature is an innovative particle characterisation system for the SEM that is specifically optimised for ease-of-use and high-speed sample throughput

PlasmaPro 800 large capacity open load RIE

PlasmaPro 800 large capacity open load RIE

Large capacity open-loading process solutions for reactive ion etch

PlasmaPro 133

PlasmaPro 133

PlasmaPro 133 for Failure Analysis and DLC applications

PlasmaPro 800 open load PECVD system

PlasmaPro 800 open load PECVD system

Large capacity open-loading process solutions for PECVD

PlasmaPro 100 RIE System

PlasmaPro 100 RIE System

Delivers anisotropic dry etching for an extensive range of processes

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 offers advanced plasma etch and deposition solutions on one platform with loadlock or cassette to cassette for RIE, ICP etch, ICP CVD and PECVD, upto 200mm single wafer platforms or multi-wafer batch capability.

PlasmaPro 100 ICPCVD System

PlasmaPro 100 ICPCVD System

Designed to produce high quality films with high density plasmas at low deposition pressures and temperatures.

PlasmaPro 100 PECVD System

PlasmaPro 100 PECVD System

Designed to produce excellent uniformity and high rate films, with control of film properties