Information Communication Technology for Compound Semiconductor devices

Compound Semiconductor devices play a pivotal role in a number of industries including:

  • Wireless
  • Consumer electronics
  • Automotive
  • Defence
  • Telecommunications

Oxford Instruments Plasma Technology is a leading supplier of process tools compatible with research and production environments.  With over 25 years experience developing low damage processes for front side applications and as well as high rate applications for backside via processes, our technologies are compatible with all materials related to this market.  Our ion beam products offer leading edge results for grating etches such as those found in DFB lasers and our ion beam deposition product offers leading optical coating technologies.
 

Products For This Application

Physical Vapour Deposition (PVD)

Physical Vapour Deposition (PVD)

Magnetron sputtering of high quality metals and alloy films

PlasmaPro 800 large capacity open load RIE

PlasmaPro 800 large capacity open load RIE

Large capacity open-loading process solutions for reactive ion etch

PlasmaPro 800 open load PECVD system

PlasmaPro 800 open load PECVD system

Large capacity open-loading process solutions for PECVD

PlasmaPro 100 RIE System

PlasmaPro 100 RIE System

Delivers anisotropic dry etching for an extensive range of processes

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 offers advanced plasma etch and deposition solutions on one platform with loadlock or cassette to cassette for RIE, ICP etch, ICP CVD and PECVD, upto 200mm single wafer platforms or multi-wafer batch capability.

PlasmaPro 100 ICPCVD System

PlasmaPro 100 ICPCVD System

Designed to produce high quality films with high density plasmas at low deposition pressures and temperatures.

PlasmaPro 100 PECVD System

PlasmaPro 100 PECVD System

Designed to produce excellent uniformity and high rate films, with control of film properties

PlasmaPro 100 Estrelas Deep Silicon Etch System

PlasmaPro 100 Estrelas Deep Silicon Etch System

Designed to give total flexibility for Deep Silicon Etch (DSiE) applications

Dr Ziad Melhem of Oxford Instruments NanoScience will be giving a talk at MIT on the enabling technologies, require… https://t.co/MDz2SojzYv
5:21 PM - 16 Feb 18
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