With the MEMS industry expected to see double digit growth up to 20161, the development and commercialisation of new MEMS applications is becoming a reality.

Traditional devices such as accelerometers, gyroscopes and microphones continue to see increased adoption in many consumer electronics, displays and automotive applications. 

The reality is that MEMS can provide a solution where there is a requirement for a device or sensor to be miniaturised2
Devices emerging in the R&D phase include energy harvesting; speakers; RFID; pico projectors; oscillators; micro fuel cells; and autofocus technologies amongst others3

Oxford Instruments Plasma Technology continues to provide technologies that address existing and emerging applications in the MEMS market.  With a broad process and application portfolio our technologies enable many of the applications identified today and those of tomorrow

1. (isuppli corp), 2. (A.M. Fitzgerald and Associates), 3. (Yole Development)

Process Technologies offered to the MEMS market sector include:

Products For This Application

Thin film analysis in the SEM: LayerProbe

Thin film analysis in the SEM: LayerProbe

LayerProbe is a thin film analysis tool tool that measures the thickness and composition of multiple layers in thin film structures in the SEM. It is an extension to AZtec EDS analysis.

Thin film analysis in the SEM: LayerProbe

Thin film analysis in the SEM: LayerProbe

LayerProbe is a thin film analysis tool that measures the thickness and composition of multiple layers in thin film structures in the SEM. It is an extension to AZtec EDS analysis.

OpAL_Montage

OpAL ALD Tool

Open loaded thermal ALD tool with plasma option

PlasmaPro 80 compact RIE tool

PlasmaPro 80 compact RIE tool

PlasmaPro 80 compact open loading RIE tool

PlasmaPro 100 RIE System

PlasmaPro 100 RIE System

Delivers anisotropic dry etching for an extensive range of processes

FlexAL-montage

FlexAL ALD Tool

Remote plasma & thermal ALD in one flexible tool

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 offers advanced plasma etch and deposition solutions on one platform with loadlock or cassette to cassette for RIE, ICP etch, ICP CVD and PECVD, upto 200mm single wafer platforms or multi-wafer batch capability.

PlasmaPro 80 Cobra compact ICP etch tool

PlasmaPro 80 Cobra compact ICP etch tool

Compact open-loading tool for plasma etch

PlasmaPro 80 PECVD

PlasmaPro 80 PECVD

Compact open-loading tool for Plasma Enhanced Chemical Vapour Deposition (PECVD)

PlasmaPro 100 ICPCVD System

PlasmaPro 100 ICPCVD System

Designed to produce high quality films with high density plasmas at low deposition pressures and temperatures.

PlasmaPro 100 PECVD System

PlasmaPro 100 PECVD System

Designed to produce excellent uniformity and high rate films, with control of film properties

PlasmaPro 80 ICPCVD system

PlasmaPro 80 ICPCVD system

PlasmaPro 80 Stratum ICPCVD system

PlasmaPro 100 Estrelas Deep Silicon Etch System

PlasmaPro 100 Estrelas Deep Silicon Etch System

Designed to give total flexibility for Deep Silicon Etch (DSiE) applications