Multiple plasma systems being installed at the Nanotechnology Center, University of Science and Technology of China (UCST)
20 November 2013
Oxford Instruments is currently installing several PlasmaPro plasma etch and deposition tools at the Nanotechnology Center at the University of Science and Technology of China to facilitate their fundamental research in micro- and nano-scale technology. USTC’s state-of-the-art nanofabrication facility based in Hefei, An’hui Province-East China, strives to drive collaborative, interdisciplinary, and fundamental research in the micro- and nano-scale.
Dr.Zhu Xuelin comments, “UCST has a very strong background in the fields of nanoscale science and engineering. The Nanotechnology Center recently ordered a PlasmaPro100 ICP380 system for Si Etching, a PlasmaPro80 RIE advanced etching tool for SiO2 and SiNx etching, in addition to a PlasmaPro100 PECVD system for SiO2 and SiNx deposition from Oxford Instruments. These systems will be used to replicate and form various nanostructures on wafers, which is highly critical in several nanoscale science fields including quantum physics, quantum information, nano-materials and nano-chemistry. We chose Oxford Instruments tools as they could provide the multiple leading edge technologies, excellent process flexibility and capabilities, backed by the effective customer support offering that UCST expects.”
“As a leading plasma etch and deposition tool manufacturer, one of our key advantages is that we offer a wide range of R&D process and system solutions, making us the ideal provider to research institutes worldwide”, said Dr David Haynes, Sales and Marketing Director at Oxford Instruments, “At UCST researchers are pushing the limits in nanoscience, nanoengineering, and nanotechnology to create novel materials, structures, and devices, and we are delighted that our systems are facilitating this excellent work.”