Oxford Instruments wins etch system order from SITP Shanghai
16 September 2013
Leading provider of etch and deposition systems to the global semiconductor research market, Oxford Instruments, has just won an order for its PlasmaPro 100 etch system from the prestigious multi-disciplinary Shanghai Institute of Technical Physics of the Chinese Academy of Sciences (SITP-CAS). This leading institute will use the advanced plasma etch system for its semiconductor research.
Mr. Heliang Xu from the SIPT commented, "SITP has PECVD and RIE systems installed that are mainly focused on non-metal films, which have been applied to light sensitive devices, passivation and multi-layer metal layout isolation with excellent results. Our recently purchased PlasmaPro 100 ICP system will be used for thick dielectric etch where good results have already been obtained good results with the CMOS image sensor devices.”
Mr Xu continued, “We have been using Oxford Instruments systems for over 30 years, and are impressed with the service support, prompt reaction to customer needs and the wide range of application capabilities. We are happy to work with Oxford Instruments on research and development.”
“PlasmaPro 100 process modules are built on 200mm platforms, with single wafer and multi-wafer batch capability. The systems offer excellent uniformity and high throughput processes on a range of applications.” said Jeffery Seah, Business Manager Asia for Oxford Instruments. “We are delighted to have won this order from such a prominent and innovative research centre as SITP, in the rapidly growing Chinese market. This versatile etch system is backed by our exclusive library of over 6,000 process recipes, and a global customer support network, made it the system of choice for this research environment.”