FlexAL® ALD system added to CMOS compatible clean room by Fraunhofer Institute for Photonic Microsystems - Center for Nanoelectronic Technologies
30 June 2015

The Fraunhofer Institute for Photonic Microsystems in Dresden, Germany has installed a FlexAL system for plasma enhanced and thermal ALD from Oxford Instruments Plasma Technology in its Center for Nanoelectronic Technologies.

The fields of use for the new tool are research and development on processes for metal oxides for ultra-thin integrated 3D capacitors, the development of new and unique metal ALD processes, and as a platform with a combinatorial screening concept including in-situ metrology and standardised tests for ALD/PEALD precursor development serving gas and chemical supplying companies. Additionally the FlexAL will serve as a 200mm PEALD tool for the MOEMS pilot line at the Fraunhofer IPMS.

“The Center for Nanoelectronic Technologies has a long-term experience in atomic layer deposition (ALD), which is a sophisticated process where monolayer after monolayer is built up”, comments Dr. Romy Liske, Business Unit Manager of the FhG IPMS-CNT, “ALD is the process of choice whenever precise thickness and composition control of thin films in the nanometer range are required. This is particularly the case for semiconductor devices where the smallest dimensions of some tens of nanometer are fabricated, and an increasing demand is observed for high conformal thin ALD films. Consequently, the development of materials and compounds deposited by ALD increases impressively.”

After a rigid tendering process the Oxford Instruments FlexAL PEALD system was chosen because of its capabilities as a high end ALD research and development tool. The broad range of processes enabled by the FlexAL’s design allows the combination of plasma and thermal processes in one fully automated recipe as well as the flexible precursor cabinet which enables effective combinatorial precursor screening with in-situ metrology.

“The proven performance and versatility of the Oxford Instruments FlexAL together with the availability of multiple room temperature variants of PEALD processes made it the ‘system of choice’ for the Center for Nanoelectronic Technologies. We are extremely pleased to be supplying this prestigious research institute with this,” says Dr. David Haynes, Sales, Service and Marketing Director, Oxford Instruments Plasma Technology.

ALD/PEALD precursor development

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