Silicon Nitride (SiN) Sputter Deposition

SiN has may be deposited using Physical Vapour Deposition (PVD), also known as Sputter Deposition.

Process Specification

  PlasmaPro 400
Deposition rate: > 3nm min
Refractive Index: 1.9 - 2.7 (controllable)
Uniformity: ± 5% (200mm Target Size)
Single wafer size: Up to 150mm
Batch size: 4 x 150mm or 8 x 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.

Dr Ziad Melhem of Oxford Instruments NanoScience will be giving a talk at MIT on the enabling technologies, require… https://t.co/MDz2SojzYv
5:21 PM - 16 Feb 18
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