Titanium Nitride (TiN) Deposition

TiN has may be deposited using Physical Vapour Deposition  (PVD), also known as Sputter Deposition.

Process Specification

  PlasmaPro 400
Deposition rate: > 1.5nm min
Uniformity: ± 5% (200mm Target Size)
Single wafer size: Up to 150mm
Batch size: 4 x 150mm or 8 x 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.

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