Titanium Dioxide (TiO2) Ion Beam Deposition

  Ionfab 300
Deposition rate: 0.5 - 3.5 nm/min
Uniformity: < 0.5 % - ± 3 %
Wafer size: Up to 200mm
Stress (compressive):2 < 500MPa

Notes:

  1. With 5mm edge exclusion, uniformity described below
  2. Stress and uniformity value are guaranteed for deposition rates up to 50% of maximum rate

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.