Al deposited on 1:1 and 2:1 aspect ratio Si lines. Continuous metal film on the walls.Aluminium (Al) Sputtering with excellent step coverage

Al has applications in metal interconnects and hardmask. It may be deposited using Physical Vapour Deposition  (PVD), also known as Sputter Deposition. Some process benefits include; wide temperature range, smooth surface and excellent step coverage.

Process Specification

  PlasmaPro 400
Deposition rate: > 20nm min
Uniformity: ± 5% (200mm Target Size)
Single wafer size: Up to 150mm
Batch size: 4 x 150mm or 8 x 100m

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.

 

Related Process Techniques

Physical Vapour Deposition (PVD)

Physical Vapour Deposition (PVD)

Magnetron sputtering of high quality metals and alloy films

Dr Ziad Melhem of Oxford Instruments NanoScience will be giving a talk at MIT on the enabling technologies, require… https://t.co/MDz2SojzYv
5:21 PM - 16 Feb 18
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