Gold (Au) Ion Beam Deposition (IBD)

Process Specification

  Ionfab 300
Deposition gas Ar
Typical deposition rate [nm/min] 1 to 28nm/min
Uniformity over 200mm < ±2%
Stress (compressive) < 500Mpa
Wafer size up to 200mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.