Chrome (Cr) Ion Beam Deposition (IBD)

Process Specification

Cr deposition with rotation and adjustable tilt.

  Ionfab 300
Deposition gas: Ar
Typical deposition rate [nm/min]:  1 to 6nm/min
Uniformity over 200mm:   < ±2%
Stress (compressive): < 500Mpa
Wafer size: up to 200mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.



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Offers the flexibility to perform etch and/or deposition and maximising system utilisation