Nickel (Ni) Deposition

Ni may be deposited using Physical Vapour Deposition (PVD), also known as Sputter Deposition.

Process Specification

  PlasmaPro 400
Deposition rate: > 20nm min
Uniformity: ± 5% (200mm Target Size)
Single wafer size: Up to 150mm
Batch size: 4 x 150mm or 8 x 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.