7µm dry ICP etch of LiTaO3Lithium Tantalate (LiTaO3) Dry ICP Etching

LiTaO3 and related films may be dry etched smoothly in a chlorine free process using ICP etch process chambers.

Process specification:

  PlasmaPro 100 Cobra180
Etch rate: > 50nm/min
Uniformity: < ± 5 %
Selectivity to Cr: > 5:1
Selectivity to PR: > 1:1
Wafer size: Up to 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.


Related Process Techniques

Watch our latest webinar On Demand to find out ‘How Ion Beam Deposition enables high power lasers’… https://t.co/0z7DkZh0LQ
11:45 AM - 23 Mar 18
View more of our tweets