Anisotropic RIE etch of 1 µm PZT (PR mask removed)Lead Zirconium Titanate (PZT) Etching

PZT has applications in Ferroelectric RAM, actuators, ultrasonic motors and IR detectors. It may be dry etched using the following process types:

  PlasmaPro 80 RIE PlasmaPro 100 RIE PlasmaPro 800 RIE PlasmaPro 80 Cobra65 or
PlasmaPro 100 Cobra65
PlasmaPro 100 Cobra180
Etch rate: > 10nm/min >100nm/min
Uniformity: < ± 5 % < ± 7 % < ± 5 %
Selectivity to PR: > 0.5:1
Selectivity to Pt: > 10:1
Wafer size: Up to 200mm Up to 300mm Up to 50mm Up to 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.


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