Failure Analysis Applications

  • Isotropic polyimide removal (RIE or ICP mode)
  • Isotropic Nitride (passivation) removal (PE or ICP mode)
  • Anisotropic Oxide (IMD/ILD) removal (RIE or ICP mode)
  • Anisotropic Low-K Oxide removal (RIE or ICP mode)
  • Metal skeleton removal (RIE or ICP mode)
  • Poly-Si removal (RIE mode)
  • Al and Cu removal (ICP mode)
  • Backside Bulk Si removal (ICP mode)

 

Dr Ziad Melhem of Oxford Instruments NanoScience will be giving a talk at MIT on the enabling technologies, require… https://t.co/MDz2SojzYv
5:21 PM - 16 Feb 18
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