200nm thick Mo film etched with profile >85°. The photoresist has been stripped.Molybdenum (Mo) ICP Etching

Typical results

  PlasmaPro 100 Cobra180
Rate:  >50 nm/min
Profile: >85ᵒ
Uniformity: ±5%
Selectivity to PR: >1:1
Wafer size up to 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.

Related Process Techniques

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