Platinum (Pt) ICP Etching

Pt may be dry etched using the Inductively Coupled Plasma (ICP) following process technique

  PlasmaPro 100 Cobra180
Etch rate: 100nm/min
Uniformity: < ± 5 %
Selectivity to PR: > 0.5:1
Wafer size: Up to 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.

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