Diamond Processing

Diamond offers a set of characteristics that make it an interesting choice for a wide range of applications. It has the highest known thermal conductivity, is chemically un-reactive and is the hardest known material. It also has a wide (5.5eV) indirect bandgap meaning it has a high breakdown voltage.

  • As a substrate for high power devices it is robust, lightweight and able to transfer heat from the active region better than any other material whilst tolerating high applied voltages.
  • It is a suitable replacement for silicon in MEMS devices where wear and bio-compatibility are a concern and can be combined with piezo-electric materials like AlN to form high frequency SAW devices. Its optical absportion is low across the visible spectrum, which combined with a high refractive index allows it to be used for applications like waveguiding.
  • The leading candidate for quantum information processing, where NV centres can be interrogated to give information about the quantum states.

Related Tools

PlasmaPro 800 large capacity open load RIE

PlasmaPro 800 large capacity open load RIE

Large capacity open-loading process solutions for reactive ion etch

PlasmaPro 80 compact RIE tool

PlasmaPro 80 compact RIE tool

PlasmaPro 80 compact open loading RIE tool

PlasmaPro 100 RIE System

PlasmaPro 100 RIE System

Delivers anisotropic dry etching for an extensive range of processes

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 Cobra ICP Etch

PlasmaPro 100 offers advanced plasma etch and deposition solutions on one platform with loadlock or cassette to cassette for RIE, ICP etch, ICP CVD and PECVD, upto 200mm single wafer platforms or multi-wafer batch capability.