PDMS etch Depth 90µm & profile 92°Polydimethylsiloxane (PDMS) Etching

PDMS may be dry etched using the Inductively Coupled Plasma (ICP) process technique.

  PlasmaPro 80 Cobra65 PlasmaPro 100 Cobra180
Etch rate: > 1µm/min
Uniformity: < ± 3.5 %
Selectivity to Cu: > 50:1
Wafer size: Up to 2" Up to 100mm

These results are for indicative purposes only.
For a detailed process specification please contact your sales representative.

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